| Certificates/Standards: | N; |
| Monthly Output: | Not provided |
| Regional: | Not provided |
| Packaging Information: | Not provided |
| Mode Of Payment: | Not provided |
| Delivery Lead Time: | Not provided |
| Main Sales Markets: | North America,Central/South America,Western Europe,Eastern Europe,Australasia,Asia,Middle East,Africa |
| Sample Provided: | No |
| Sample Policy: | Not provided |
| Minimum Quantity: | Not provided |
H-619 adhesive is the latest high-performance two component epoxy resin adhesive developed by our company. It has small creep, low hysteresis, good repeatability, low viscosity, wide working temperature range, short SMT cycle, and is very convenient to use. Specially recommended for C4 and above level sensor chip production.
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